Turn your proprietary hardware vision into reality. Partner with a dedicated engineering team backed by 7 years of deep hardware expertise, robust manufacturing capacity, and rigorous compliance testing.
Engineering Capability
Reliability Verification
Industry Exprience
We don’t just assemble; we engineer. Our team manages the entire computing hardware lifecycle.
Custom private molds, unique thermal dissipation architectures, ruggedized enclosures (IP-rated), and specialized form factors including dual-screen setups, convertibles, or detachable systems tailored exactly to your industry standards.
Customized motherboard layouts, proprietary I/O port configurations (RS232, RJ45, custom docking pins), high efficiency power management optimization, and specialized display logic integration.
Verified up to 30,000+ continuous open-and-close structural stress cycles without structural fatigue.
Operationally tested from -20°C up to 60°C for industrial, field, and harsh environment deployments.
Guaranteed 3-to-5-year hardware component lifecycle availability for long term enterprise contracts.
PHASE 01
BRD Review & detailed technical feasibility analysis.
PHASE 02
Full schematic capture, ID, MD, and PCBA Layout tracking.
PHASE 03
Rigorous validation through EVT, DVT, and PVT engineering cycles.
PHASE 04
High-precision industrial tooling and exclusive private mold creation.
PHASE 05
Mass production with automated line QC inspection frameworks.
Deep insights into our R&D process, customization, and supply chain stability.
A standard end-to-end ODM project spans 16 to 24 weeks, depending on complexity. The development pipeline is structured into clear validation gates:
The client owns the exclusive rights. When you finance the tooling and NRE (Non-Recurring Engineering) fees for a private mold, a comprehensive Tooling Ownership Agreement is signed. Yissiy guarantees that your unique chassis or structural architecture will not be cross-allocated, open-sourced, or sold to any other client or competitor.
We feature a dedicated in-house schematic capture and multi-layer PCB layout engineering team. We can modify or completely re-engineer the PCBA to integrate specialized enterprise I/O interfaces, such as Native RS232/RS485 serial ports, dual Gigabit RJ45 Ethernet ports, military-grade aviation plugs, hardware-level encryption modules, or unique PCIe expansion ribbon architectures.
Yes. We specialize in specialized mechanical engineering (MD). For rugged, automotive, or marine applications, we design sealed enclosures with custom rubber gaskets, fanless passive cooling thermal dissipation, and reinforced drop-resistant magnesium-aluminum alloys. We can design and pre-verify hardware to clear IP65/IP67 dust/waterproofing and MIL-STD-810H shock and vibration protocols.
We develop architectures utilizing the latest x86 enterprise platforms from Intel® (Core™ / Atom® Industrial) and AMD®, as well as ARM-based architectures for specialized low-power clients. Backed by our 7 years of tier-1 supply chain alignment, we negotiate component allocation direct from component fabricators, providing a minimum 3-to-5-year component lifecycle guarantee to protect your software deployment longevity.
NRE and tooling costs scale based on the level of customization. A simple Motherboard I/O modification on an existing chassis involves minimal setup costs. A full-scale, ground-up private mold development (including unique magnesium alloy tooling, specific display glass binding, and custom mainboard engineering) typically ranges from $30,000 to $80,000 USD. These tooling costs can be fully or partially amortized back to you once bulk order milestones are satisfied.
Due to high component allocation minimums and automated SMT factory line configurations required for custom PCBA production, the standard MOQ for deep hardware-level ODM projects is 1,000 units per annualized framework. However, during the initial prototyping phases (EVT/DVT), we support small engineering batch runs of 5 to 20 units for your laboratory software debugging and pilot field testing.
We have an explicit team of firmware engineers capable of deep BIOS/EC custom code development. We support custom secure boot keys, specialized hardware watchdog timers, custom fan-speed lookup thermal curves, and specific power-on behavioral sequencing (e.g., auto-boot upon DC power attachment). We also support OS kernel compilation and driver optimization for Windows Enterprise, customized Android x86 builds, and specific Linux distributions (Ubuntu, Debian, RedHat).
Absolutely. We provide full-service compliance management. Once the prototype clears our internal reliability test labs (thermal shock, ESD, drop, and hinge fatigue testing), we coordinate directly with authorized global test houses (such as SGS, TUV, or Intertek) to acquire CE, FCC, RoHS, UL, or CB certifications registered directly under your corporate entity name.
Customized hardware demands rigid testing architectures. Every deep customization project is assigned a dedicated Quality Engineering (QE) team. We execute automated AOI inspection post-SMT mainboard placement, 100% component-level functional diagnostics, and a mandatory 24-to-48-hour high-temperature dynamic burn-in chamber test for every single assembled laptop prior to vacuum packaging, maintaining a field failure rate strictly below 0.5%.
Tell us your requirements and our engineering team will provide a feasibility analysis within 24 hours
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It is our pleasure to answer your queries related to your business and reguirements.YISSIY will always be behind you and good cooperative partner in China for your business.。
